ps2251-07在线量产ID Error 请教老鸟帮助多谢！

ctnet · 发表于 2021-10-6 15:50:52

爱科技、爱创意、爱折腾、爱极致，我们都是技术控

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换个2309

id不对！！！

2309红.png

bbbaaa1 · 发表于 2021-10-6 20:02:09

看看前面发的贴子，东芝的颗粒好像可以量产，但海力士的不好量产

eboy998 · 发表于 2021-10-6 20:26:56

本帖最后由 eboy998 于 2021-10-6 20:29 编辑

你手艺好好焊完ID都没识别还拿去量产
flash焊接有问题再一个问题7THL为啥要换到2309上去，在2309上表现还不如2307呢

流云清风 · 发表于 2021-10-6 22:45:44

用群联的STTOOL工具量产

ctnet · 发表于 2021-10-7 10:47:02

本帖最后由 ctnet 于 2021-10-7 10:56 编辑

eboy998 发表于 2021-10-6 20:26
你手艺好好焊完ID都没识别还拿去量产
flash焊接有问题再一个问题7THL为啥要换到2309上去，在2309上表现还 ...

这个可以量产吗？

这个能量产吗？

eboy998 · 发表于 2021-10-7 12:55:37

可以，固件选XX.XX.53就行

ctnet · 发表于 2021-10-7 13:11:27

eboy998 发表于 2021-10-7 12:55
可以，固件选XX.XX.53就行

[2309]
HV_B1_D2_Firmware = 2309-D2200318.BIN
HV_BX_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_Firmware = 2309-D2Fast200331.BIN
HV_BX_FP_Firmware = 2309-D2Fast200331.BIN
HV_PG_D2_DUMMMY_Firmware = 2309-D2200318.BIN
HV_PG_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_1P_Firmware = 2309-D2200318.BIN
HV_BX_FF_Enhance_Firmware = 2309-D2200318.BIN
HV_PG_D2_A2_Firmware = 2309-D2200318.BIN
HV_BX_2P_PURE_Firmware = 2309-D2200331_H.BIN

HV_BX_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_TSB3D_Firmware = 2309PRAM_7.00.5D.T_20171130.BIN
HV_BX_Normal_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_TSB3D_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_Micron3D_Firmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_B1_ED3_MicronFirmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_BX_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_LMU_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_BX_Mircon_2P_Firmware = 2309_hv3_ED3_M_2P.BIN

HV_BX_ED3_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_Hynix3DFirmware= 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_Hynix3D_2P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN
HV_BX_Hynix3D_4P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN

//Hynix V4 MLC
HV_PG_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_2P_Firmware = 2309_hv3_ED3_H_2P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_D1_Firmware = 2309-D2200318.BIN

HV_BX_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_TSB3D_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_MicronFirmware = 2309-D2200318.BIN
HV_PG_ED3_N18_D1_Fw = 2309-D2_N18_180528.BIN

[2307]
HV_BX_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FF_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_DUMMMY_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FP_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_BX_FF_1P_Firmware = 2307_1P_ED2_fastRN_FF01_20170427.BIN
HV3_BX_D2_Firmware = 2307_2P_fastRN_FF01_20170427.BIN

HV_BX_ED3_Firmware = 2307_ED3_20170810.BIN
HV_BX_ED3_LMU_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_LMU_Firmware = 2307_ED3_20170810.BIN

HV_BX_ED3_D1_Firmware = 2307_D1_20160322.BIN
HV_PG_ED3_D1_Firmware = 2307_D1_20160322.BIN

HV_PG_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN
HV_BX_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN

HV_BX_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN
HV_PG_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN

HV_PG_ED3_TSB3D_Firmware = 2307_ED3_ff01_20170829.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2307_ED3_ff01_20170829.BIN

HV_BX_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_Mircon_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_TSB3D_2P_Firmware = 2307_hv3_ED3_2P.BIN

HV_PG_ED3_TSB3D_D1_Firmware = 2307PRAM_FF01.BIN

没找到53

ctnet · 发表于 2021-10-7 13:13:58

HV_BX_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN

HV_PG_ED3_TSB3D_D1_Firmware = 2307PRAM_FF01.BIN

ctnet · 发表于 2021-10-7 15:49:54

eboy998 发表于 2021-10-7 12:55
可以，固件选XX.XX.53就行

找到了~~抱歉，您的帖子小于 12 个字

eboy998 · 发表于 2021-10-7 18:54:29

为啥要用黑片固件呢用MPALL工具里的工具
例如这样的
Burner File=F:\Phison_2251-07_MPALL\MPALL_v5.03.0D\BN07V600T9.BIN
Firmware Name=F:\Phison_2251-07_MPALL\MPALL_v5.03.0D\FW07FF01V50353_20160720.bin