求助：PS2251-09，使用st-tool-3.7f.92 量产问题

yanghuiyu

请教一下大家，这种情况是不是量产工具版本不对，还是设置有问题，在网上有看到别人用 st-tool-3.7f.53 量产成功的，但是不知道在哪里下载到。请求大家的帮助，谢谢；

yanghuiyu

用低格+高格2个多小时后，就显示坏块多

QIQI737

群联PS2251-09（UP309）丢了固件，自己量产成功的凤毛麟角。

yanghuiyu

E:\TOOL\U盘工具\1.png E:\TOOL\U盘工具\2.png

yanghuiyu

量产成功了，感谢前辈们的帖子，和网上一个高人的指定。

yanghuiyu

上传下图片，留个纪念，折腾了好多天，一直都没有放弃，每次到网上搜索都能找到点新发现，最后绝望的时候多亏一个叫huller的网友的指点，然后结合之前的学习，多次尝试，终于救活了这个U盘。

swat3

我觉得MPALL_F1_7F00_DL07_v503_0A可能速度快一些啊，st-tool-速度慢！但是一定要找好量产的固件和你之前的版本对不对应啊！:loveliness:

yanghuiyu

MPALL_7F00_DL07_v503_0A 这个不支持PS2251-09 ,MPALL v3.89.0C 才支持，但是没有海力士的固件，而且我的U 盘点开始一直没有反应，不知道什么原因，ST-TOOL V3.7F.90  开始支持PS2251-09 但是一直没有海力士的固件，所以导致之前一直量产失败，到 ST-TOOL V3.80.0C 才开始有海力士的固件，我用 ST-TOOL V3.80.14 量产模式3 只需要1分多钟，速度应该可以了

zoki

yanghuiyu 发表于 2020-11-18 19:38
MPALL_7F00_DL07_v503_0A 这个不支持PS2251-09 ,MPALL v3.89.0C 才支持，但是没有海力士的固件，而且我的U  ...

能不能发下 ST-TOOL V3.80.14 ，谢谢
54601838@qq.com

yanghuiyu

链接: https://pan.baidu.com/s/1YL4baec2XwUguZ9-7dGpww 提取码: sj4x

QIQI737

yanghuiyu 发表于 2020-11-18 11:51
量产成功了，感谢前辈们的帖子，和网上一个高人的指定。

恭喜恭喜！你这个帖子大概是论坛第一个量产成功UP309主控U盘的帖子，你写一个具体量产步骤的帖子，是怎么设置、怎么刷固件的肯定会火！！！

bbbaaa1

yanghuiyu 发表于 2020-11-19 11:19
链接: https://pan.baidu.com/s/1YL4baec2XwUguZ9-7dGpww 提取码: sj4x

能不能发个教程，怎么设置的？

zoki

yanghuiyu 发表于 2020-11-19 11:19
链接: https://pan.baidu.com/s/1YL4baec2XwUguZ9-7dGpww 提取码: sj4x

万分感谢！！

yanghuiyu

bbbaaa1 发表于 2020-11-19 23:03
能不能发个教程，怎么设置的？

我简单说下我的过程，当初想把U盘做成CDROM盘装系统，很多年前用安国的U盘就做过，所以觉得这个应该不难，然后就用检测工具，检测了U盘主控，是PS2251-09，然后就下载了工具STTOOL_V37F_99_SZ_20181107，按照网上的设置，选了固件，一刷U盘就变砖了，当时以为是设置问题，然后就到网上搜索了很多关于设置的教程，去尝试，结果是，用高格 就会变成检测IB 20%不动了，用低格就会变成 2个多小时后 就说坏块多，失败，（网上也有人这样说过）后面我就改了下设置，低格用 强制D1模式，40多分钟后，格式化成功了，然后再用高格，就会出现CALL FW 一直不动，后面失败，报告里面显示是 选择FW模式错误，从这里可以看出，固件选错了，但是又不知道选哪个，然后把固件里面每个2309的都选了一遍，最后还是失败了，同时在论坛上发帖求帮助，看到有几个成功的，发信息去问他们要工具，最后是有的没有回消息，有的说找不到了。网上有的说在XP系统下成功的，我又装了个虚拟XP系统，还是一样的效果，涮了很多次后，U盘盘符都不识别了，只能用短路来解决，论坛上看到有点希望的工具都下了，最后还是发现 只有STTOOL_V37F_99_SZ_20181107还能有点用，就是会失败，这样折腾了3个礼拜时间，并不是为了修好这个U盘努力去尝试，U盘也没有多少钱，就是想为了证明下自己的解决问题的方法和能力，所以一直有股无形的动力在推动着往前走，后面终于经别人指点，因为我的是海力士的FLASH，这个工具里面就没有关于这个的固件，新版本的升级工具里有，然后就下了STTOOL_V380_14_SZ_20200506_JC 但是U盘插进去没有反应，短路也无效，用网上说的移花接木方法，我就把STTOOL_V37F_99_SZ_20181107 里面的配置文件，放到 STTOOL_V380_14_SZ_20200506_JC里面，这样就可以识别U盘了，（后面发现是在里面的配置文件 【configuration】 下面加一个 Mapping=0 也可以识别U盘）选好海力士的固件，低格我担心时间太长，就选了高格+全新片，模式3，看那个进度条走的非常顺，和之前完全不一样，CALL FW 一下子就过去，一分多钟，很快就量产好了，然后再测试模式21 ，因为要拷贝ISO文件，稍微慢一点，也成功了，其它地方配置都没有改，所以这样看来，STTOOL工具配置是很简单，没什么改动，关键是选对固件。在ISP_INFO 里面有个ST_ISP的文件，里面可以看到固件的稍微详细的对应。遗憾的一点是，把外壳给破坏了，最后装上去有点丑。

yanghuiyu

QIQI737 发表于 2020-11-19 21:57
恭喜恭喜！你这个帖子大概是论坛第一个量产成功UP309主控U盘的帖子，你写一个具体量产步骤的帖子，是怎么 ...

U盘修复了，接下来就不弄这个了，没有意思了，通过找资源这个过程中，感觉十分困难，后面发现，论坛里面都有指明方向了，只是没有被发现，感谢那些前辈们，我也重复发一下，方便继续折腾的朋友们，U量产工具可以到这个网站里去找，这里面发布的工具，应该比在百度里找领先很长时间。http://www.usbdev.ru

QIQI737

yanghuiyu 发表于 2020-11-20 09:19
U盘修复了，接下来就不弄这个了，没有意思了，通过找资源这个过程中，感觉十分困难，后面发现，论坛里面 ...

首先谢谢楼主！如果没有你的这个贴子和你分享的工具，我那个在抽屉里躺了两年的台电锋芒128G的U盘就没救了。你说的对，我们折腾不是舍不得丢弃这个U盘，我们是享受这个起起伏伏的折腾过程，今年陆陆续续收集了60多个各种容量的雷克沙Mlc颗粒的U盘，好多还没开封，之所以买这么多雷克沙是因为收集的这些U盘都是慧荣主控的，就因为这个群联主控的台电锋芒我都对群联主控的U盘绝望了，以至于认为群联主控的U盘出了问题基本上就没得救。通过这次折腾现在我觉得群联主控的U盘没有我以前认为的那么不好！对了，我觉得你用群联主控的U盘做启动盘很可能会遇到不兼容的情况，做启动盘我觉得还是慧荣SM3267AE最好用，兼容性极强！

柱柱柱先生

yanghuiyu 发表于 2020-11-20 08:59
我简单说下我的过程，当初想把U盘做成CDROM盘装系统，很多年前用安国的U盘就做过，所以觉得这个应该不难 ...

非常感谢 ，今天手贱量产坏了
终于用你的方法解决了！
万分感谢！

iceliminghui

yanghuiyu 发表于 2020-11-20 08:59
我简单说下我的过程，当初想把U盘做成CDROM盘装系统，很多年前用安国的U盘就做过，所以觉得这个应该不难 ...

楼主，你是怎么识别哪个固件适合自己的？每个都测试一遍么？
另外，ISP_INFO里的是对应“主机端口”的吧？

ctnet

yanghuiyu 发表于 2020-11-20 08:59
我简单说下我的过程，当初想把U盘做成CDROM盘装系统，很多年前用安国的U盘就做过，所以觉得这个应该不难 ...

[General]
MPProgram = v513_0C
MPProgramF2 = v512_0C

[2309]
HV_B1_D2_Firmware = 2309-D2200318.BIN
HV_BX_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_Firmware = 2309-D2Fast200331.BIN
HV_BX_FP_Firmware = 2309-D2Fast200331.BIN
HV_PG_D2_DUMMMY_Firmware = 2309-D2200318.BIN
HV_PG_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_1P_Firmware = 2309-D2200318.BIN
HV_BX_FF_Enhance_Firmware = 2309-D2200318.BIN
HV_PG_D2_A2_Firmware = 2309-D2200318.BIN
HV_BX_2P_PURE_Firmware = 2309-D2200331_H.BIN

HV_BX_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_TSB3D_Firmware = 2309PRAM_7.00.5D.T_20171130.BIN
HV_BX_Normal_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_TSB3D_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_Micron3D_Firmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_B1_ED3_MicronFirmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_BX_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_LMU_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_BX_Mircon_2P_Firmware = 2309_hv3_ED3_M_2P.BIN

HV_BX_ED3_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_Hynix3DFirmware= 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_Hynix3D_2P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN
HV_BX_Hynix3D_4P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN

//Hynix V4 MLC
HV_PG_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_2P_Firmware = 2309_hv3_ED3_H_2P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_D1_Firmware = 2309-D2200318.BIN

HV_BX_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_TSB3D_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_MicronFirmware = 2309-D2200318.BIN
HV_PG_ED3_N18_D1_Fw = 2309-D2_N18_180528.BIN


[2307]
HV_BX_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FF_Firmware  = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_DUMMMY_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FP_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_BX_FF_1P_Firmware = 2307_1P_ED2_fastRN_FF01_20170427.BIN
HV3_BX_D2_Firmware = 2307_2P_fastRN_FF01_20170427.BIN

HV_BX_ED3_Firmware = 2307_ED3_20170810.BIN
HV_BX_ED3_LMU_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_LMU_Firmware = 2307_ED3_20170810.BIN

HV_BX_ED3_D1_Firmware = 2307_D1_20160322.BIN
HV_PG_ED3_D1_Firmware = 2307_D1_20160322.BIN

HV_PG_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN
HV_BX_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN

HV_BX_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN
HV_PG_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN

HV_PG_ED3_TSB3D_Firmware = 2307_ED3_ff01_20170829.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2307_ED3_ff01_20170829.BIN

HV_BX_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_Mircon_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_TSB3D_2P_Firmware =  2307_hv3_ED3_2P.BIN

HV_PG_ED3_TSB3D_D1_Firmware = 2307PRAM_FF01.BIN

[2267]
HV_BX_D2_Firmware = 226X-D2FW_20180912.bin
HV_BX_FF_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_BX_FF_Enhance_Firmware = 226X-D2FW-eFastRN_20180912.bin
HV_BX_FP_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_PG_D2_Firmware = 226X-D2FW_20180912.bin
HV_PG_D2_DUMMMY_Firmware = 226X-D2FW-FastRN_20180912.bin
HV3_BX_D2_Firmware = 226X-D2FW_20180912.bin
HV_PG_RPM_Firmware = 226X-D2FW-160919-RPM.bin
HV_COPYBACK_FF_Firmware = 226X-D2FW-141016-SVN884-CB.bin
HV_MultiWrite_Firmware = 226X-D2FW-140916-FASTRNMULTIWRITE-SVN791.bin

HV_BX_FP_Firmware = 226X-D2FW-FastRNPBA_20161201.bin

HV_BX_ED3_Firmware = 2267FW060334_20180503.BIN
HV_BX_ED3_LMU_Firmware = 2267FW060334_20180503.BIN
HV_PG_ED3_Firmware= 2267FW060334_20180503.BIN
HV_PG_LMU_ED3_Firmware = 2267FW060334_20180503.BIN
HV_PG_ED3_LMU_Firmware = 2267FW060334_20180503.BIN

HV_BX_ED3_D1_Firmware = 2261PRAM_20171019.BIN
HV_PG_ED3_D1_Firmware = 2261PRAM_20171019.BIN

[2268]
HV_B1_D2_Firmware = D2FW68FF01V10930.bin
HV_B1_D3_Firmware = D3FW68FF01V11334.bin

HV_BX_D2_Firmware = 226X-D2FW_20180912.bin
HV_BX_FF_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_BX_FF_Enhance_Firmware = 226X-D2FW-eFastRN_20180912.bin
HV_BX_FP_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_PG_D2_Firmware = 226X-D2FW_20180912.bin
HV_PG_D2_DUMMMY_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_PG_RPM_Firmware = 226X-D2FW-160919-RPM.bin
HV_COPYBACK_FF_Firmware = 226X-D2FW-141016-SVN884-CB.bin
HV_MultiWrite_Firmware = 226X-D2FW-FastRN_20180912.bin
HV_MultiWrite_Enhance_Firmware = 226X-D2FW-FastRN_20180912.bin
HV3_BX_D2_Firmware = 226X-D2FW_20180912.bin

HV_BX_D2_N85_Firmware = 226X-D2FW-N85-20170706.bin

HV_BX_FP_Firmware = 226X-D2FW-FastRNPBA_20161201.bin

HV_BX_Normal_ED3_Firmware = 2267FW060334_20180503.BIN
HV_BX_ED3_Firmware = 2267FW060334_20180503.BIN
HV_BX_ED3_LMU_Firmware = 2267FW060334_20180503.BIN
HV_PG_ED3_Firmware= 2267FW060334_20180503.BIN
HV_PG_LMU_ED3_Firmware = 2267FW060334_20180503.BIN
HV_PG_ED3_LMU_Firmware = 2267FW060334_20180503.BIN

HV_BX_Normal_ED3_Firmware_8K = 2267FW060334_20170921_8K.BIN
HV_BX_ED3_Firmware_8K = 2267FW060334_20170921_8K.BIN
HV_BX_ED3_LMU_Firmware_8K = 2267FW060334_20170921_8K.BIN
HV_PG_ED3_Firmware_8K = 2267FW060334_20170921_8K.BIN
HV_PG_LMU_ED3_Firmware_8K = 2267FW060334_20170921_8K.BIN
HV_PG_ED3_LMU_Firmware_8K = 2267FW060334_20170921_8K.BIN

HV_BX_ED3_D1_Firmware = 2261PRAM_20171019.BIN
HV_PG_ED3_D1_Firmware = 2261PRAM_20171019.BIN

HV_BX_ED3_HynixFirmware = 2267FW060334_Hynix_20171003.BIN
HV_BX_ED3_LMU_HynixFirmware = 2267FW060334_Hynix_20171003.BIN
HV_PG_ED3_HynixFirmware = 2267FW060334_Hynix_20171003.BIN
HV_PG_ED3_LMU_HynixFirmware = 2267FW060334_Hynix_20171003.BIN

HV_PG_ED3_D1_HynixFirmware = 2261PRAM_20171019.BIN
HV_BX_ED3_D1_HynixFirmware = 2261PRAM_20171019.BIN

HV_BX_ED3_MicronFirmware = 2267FW060334_Micron_20160923.BIN
HV_BX_ED3_LMU_MicronFirmware = 2267FW060334_Micron_20160923.BIN
HV_PG_ED3_MicronFirmware= 2267FW060334_Micron_20160923.BIN
HV_PG_ED3_LMU_MicronFirmware = 2267FW060334_Micron_20160923.BIN

HV_PG_ED3_D1_MicronFirmware = 2261PRAM_20171019.BIN
HV_BX_ED3_D1_MicronFirmware = 2261PRAM_20171019.BIN

// 2Plane FW for SZ
HV_BX_ED3_2P_Firmware = 2267FW060334_20170110_Checkoff.BIN
HV_BX_Hynix_2P_Firmware = 2267FW060334_Hynix_20161128.BIN

HV_B1_ED3_TSB3D_Firmware = 2268FWTSB3D1P_20180402.BIN
HV_BX_ED3_TSB3D_Firmware = 2268FWTSB3D1P_20180402.BIN
HV_PG_ED3_TSB3D_Firmware = 2268FWTSB3D1P_20180402.BIN

[2269]
//ED3 16K
HV_BX_Normal_ED3_Firmware = 2270FW070034_20180906.bin
HV_BX_ED3_Firmware = 2270FW070034_20180906.bin
HV_BX_ED3_LMU_Firmware = 2270FW070034_20180906.bin
HV_PG_ED3_Firmware= 2270FW070034_20180906.bin
HV_PG_LMU_ED3_Firmware = 2270FW070034_20180906.bin
HV_PG_ED3_LMU_Firmware = 2270FW070034_20180906.bin

HV_BX_2P_Firmware = 2270FW060334_2p_20180420.BIN
HV_BX_ED3_2P_Firmware = 2270FW060334_2p_20180420.BIN

HV_BX_ED3_D1_Firmware = 2269-D2FW200320.bin
HV_PG_ED3_D1_Firmware = 2269-D2FW200320.bin

//ED3 8K
HV_BX_Normal_ED3_Firmware_8K = 2270FW07XX34_20190129_8K.bin
HV_BX_ED3_Firmware_8K = 2270FW07XX34_20190129_8K.bin
HV_BX_ED3_LMU_Firmware_8K = 2270FW07XX34_20190129_8K.bin
HV_PG_ED3_Firmware_8K = 2270FW07XX34_20190129_8K.bin
HV_PG_LMU_ED3_Firmware_8K = 2270FW07XX34_20190129_8K.bin
HV_PG_ED3_LMU_Firmware_8K = 2270FW07XX34_20190129_8K.bin

HV_PG_ED3_D1_Firmware_8K = 2269-D2FW171114.bin
HV_BX_ED3_D1_Firmware_8K = 2269-D2FW171114.bin

HV3_BX_D2_Firmware = 2269-D2FW200320.bin
HV_BX_D2_Firmware =2269-D2FW200320.bin
HV_BX_FF_Firmware = 2269-D2FW-FastRN_20200318.bin
HV_BX_FF_Enhance_Firmware = 2269-D2FW-eFastRN_20200318.bin
HV_BX_FP_Firmware = 2269-D2FW-FastRN_20200313.bin
HV_PG_D2_Firmware = 2269-D2FW200320.bin
HV_PG_D2_DUMMMY_Firmware = 2269-D2FW-FastRN_20200313.bin
HV_MultiWrite_Firmware = 2269-D2FW-FastRN_20200313.bin
HV_MultiWrite_Enhance_Firmware = 2269-D2FW-FastRN_20200313.bin

HV3_BX_D2_2P_Firmware = 2269-D2FW200320.bin
HV_PG_D2_A2_Firmware = 2269-D2FW200320.bin

//Hynix ed3
HV_BX_ED3_HynixFirmware = 2270FW060334_HY_20171013.BIN
HV_BX_ED3_LMU_HynixFirmware = 2270FW060334_HY_20171013.BIN
HV_PG_ED3_HynixFirmware= 2270FW060334_HY_20171013.BIN
HV_PG_ED3_LMU_HynixFirmware = 2270FW060334_HY_20171013.BIN

HV_BX_Hynix_2P_Firmware = 2270FW060334_HY_2P_20181217.bin
HV_PG_ED3_D1_HynixFirmware = 2269-D2FW171114.bin
HV_BX_ED3_D1_HynixFirmware = 2269-D2FW171114.bin


//Hynix 3D
HV_BX_ED3_Hynix3DFirmware = 2270FW_Hynix_1P_20191115.BIN
HV_BX_ED3_LMU_Hynix3DFirmware = 2270FW_Hynix_1P_20191115.BIN
HV_PG_ED3_Hynix3DFirmware= 2270FW_Hynix_1P_20191115.BIN
HV_PG_ED3_LMU_Hynix3DFirmware = 2270FW_Hynix_1P_20191115.BIN

HV_BX_Hynix3D_2P_Firmware = 2270FW_Hynix_2P_20191115.BIN

HV_PG_ED3_D1_Hynix3DFirmware = 2269-D2FW200320.bin
HV_BX_ED3_D1_Hynix3DFirmware = 2269-D2FW200320.bin
HV_PG_ED3_D1_2P_Hynix3DFirmware = 2269-D2FW190116T.bin
HV_BX_ED3_D1_2P_Hynix3DFirmware = 2269-D2FW190116T.bin

//Hynix V4 MLC
HV_PG_ED2_HynixV4Firmware = 2270FW_1P_8A1B_20191115.BIN
HV_BX_ED2_HynixV4Firmware = 2270FW_1P_8A1B_20191115.BIN
HV_BX_ED2_HynixV4_2P_Firmware = 2270FW_1P_8A1B_20191115.BIN
HV_BX_ED2_HynixV4_D1_Firmware = 2269-D2FW200320.bin

//Micron
HV_B1_ED3_MicronFirmware = 2270FWxxxxxx_20190523_SZ.BIN
HV_BX_ED3_MicronFirmware = 2270FWxxxxxx_20190523_SZ.BIN
HV_BX_ED3_LMU_MicronFirmware = 2270FWxxxxxx_20190523_SZ.BIN
HV_PG_ED3_MicronFirmware = 2270FWxxxxxx_20190523_SZ.BIN
HV_PG_ED3_LMU_MicronFirmware = 2270FWxxxxxx_20190523_SZ.BIN

HV_BX_Mircon_2P_Firmware = 2270FWxxxxxx_2P_20181030.BIN

HV_PG_ED3_D1_MicronFirmware = 2269-D2FW200320.bin
HV_BX_ED3_D1_MicronFirmware = 2269-D2FW200320.bin

//T/S 3D
HV_PG_ED3_TSB3D_Firmware = 2270FW9XX_T_1P_20200407.bin
HV_PG_ED3_TSB3D_LMU_Firmware = 2270FW9XX_T_1P_20200407.bin
HV_BX_ED3_TSB3D_Firmware = 2270FW9XX_T_1P_20200407.bin
HV_BX_ED3_TSB3D_LMU_Firmware = 2270FW9XX_T_1P_20200407.bin

HV_BX_TSB3D_2P_Firmware = 2270FW060334_2P_20190121.bin

HV_PG_ED3_TSB3D_D1_Firmware = 2269-D2FW200320.bin
HV_BX_ED3_TSB3D_D1_Firmware = 2269-D2FW200320.bin



是这个文件吗？

yanyan171

我当年也有过一个这玩意，然后拿去给台电换新了，换新回来到手坏，台电还要我出运费，于是12315投诉台电，台电说我出运费，给我换了个幻影
当时的幻影已经是锋芒pro的方案了，所以说白了也没赚啥