ps2251-07在线量产ID Error 请教老鸟帮助 多谢！

ctnet

换个2309


id不对！！！

bbbaaa1

看看前面发的贴子，东芝的颗粒好像可以量产，但海力士的不好量产

eboy998

你手艺好好 焊完ID都没识别还拿去量产
flash焊接有问题再一个问题7THL为啥要换到2309上去，在2309上表现还不如2307呢

流云清风

用群联的STTOOL工具量产

ctnet

eboy998 发表于 2021-10-6 20:26
你手艺好好 焊完ID都没识别还拿去量产
flash焊接有问题再一个问题7THL为啥要换到2309上去，在2309上表现还 ...

这个可以量产吗？


这个能量产吗？

eboy998

可以，固件选XX.XX.53就行

ctnet

eboy998 发表于 2021-10-7 12:55
可以，固件选XX.XX.53就行

[2309]
HV_B1_D2_Firmware = 2309-D2200318.BIN
HV_BX_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_Firmware = 2309-D2Fast200331.BIN
HV_BX_FP_Firmware = 2309-D2Fast200331.BIN
HV_PG_D2_DUMMMY_Firmware = 2309-D2200318.BIN
HV_PG_D2_Firmware = 2309-D2200318.BIN
HV_BX_FF_1P_Firmware = 2309-D2200318.BIN
HV_BX_FF_Enhance_Firmware = 2309-D2200318.BIN
HV_PG_D2_A2_Firmware = 2309-D2200318.BIN
HV_BX_2P_PURE_Firmware = 2309-D2200331_H.BIN

HV_BX_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_TSB3D_Firmware = 2309PRAM_7.00.5D.T_20171130.BIN
HV_BX_Normal_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN
HV_BX_TSB3D_2P_Firmware = 2309_hv3_ED3_T_2P_20200327.BIN

HV_B1_ED3_Micron3D_Firmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_B1_ED3_MicronFirmware = 2309PRAM_Micron_FSP_2017_12_22.BIN
HV_BX_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_PG_ED3_LMU_MicronFirmware = 2309_hv3_ED3_M_1P.BIN
HV_BX_Mircon_2P_Firmware = 2309_hv3_ED3_M_2P.BIN

HV_BX_ED3_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_Hynix3DFirmware= 2309_hv3_ED3_H_1P_20200109.BIN
HV_PG_ED3_LMU_Hynix3DFirmware = 2309_hv3_ED3_H_1P_20200109.BIN
HV_BX_Hynix3D_2P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN
HV_BX_Hynix3D_4P_Firmware = 2309_hv3_ED3_H_4P_20200109.BIN

//Hynix V4 MLC
HV_PG_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4Firmware = 2309_hv3_ED3_H_1P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_2P_Firmware = 2309_hv3_ED3_H_2P_8A1B_20200109.BIN
HV_BX_ED2_HynixV4_D1_Firmware = 2309-D2200318.BIN

HV_BX_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_TSB3D_D1_Firmware = 2309-D2200318.BIN
HV_PG_ED3_D1_MicronFirmware = 2309-D2200318.BIN
HV_PG_ED3_N18_D1_Fw = 2309-D2_N18_180528.BIN


[2307]
HV_BX_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FF_Firmware  = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_DUMMMY_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_PG_D2_Firmware = 2307_ED2_Block_FF01_20170427.BIN
HV_BX_FP_Firmware = 2307_2P_fastRN_FF01_20170427.BIN
HV_BX_FF_1P_Firmware = 2307_1P_ED2_fastRN_FF01_20170427.BIN
HV3_BX_D2_Firmware = 2307_2P_fastRN_FF01_20170427.BIN

HV_BX_ED3_Firmware = 2307_ED3_20170810.BIN
HV_BX_ED3_LMU_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_Firmware = 2307_ED3_20170810.BIN
HV_PG_ED3_LMU_Firmware = 2307_ED3_20170810.BIN

HV_BX_ED3_D1_Firmware = 2307_D1_20160322.BIN
HV_PG_ED3_D1_Firmware = 2307_D1_20160322.BIN

HV_PG_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN
HV_BX_ED3_D1_HynixFirmware = 2307_D1_20160322.BIN

HV_BX_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN
HV_PG_ED3_MicronFirmware = 2307_ED3_B16_onfi.BIN

HV_PG_ED3_TSB3D_Firmware = 2307_ED3_ff01_20170829.BIN
HV_PG_ED3_TSB3D_LMU_Firmware = 2307_ED3_ff01_20170829.BIN

HV_BX_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_Mircon_2P_Firmware = 2307_hv3_ED3_2P.BIN
HV_BX_TSB3D_2P_Firmware =  2307_hv3_ED3_2P.BIN

HV_PG_ED3_TSB3D_D1_Firmware = 2307PRAM_FF01.BIN


没找到53

ctnet

HV_BX_ED3_Firmware = 2309_hv3_ED3_T_1P_20200401.BIN

HV_PG_ED3_TSB3D_D1_Firmware = 2307PRAM_FF01.BIN

ctnet

eboy998 发表于 2021-10-7 12:55
可以，固件选XX.XX.53就行

找到了~~抱歉，您的帖子小于 12 个字

eboy998

为啥要用黑片固件呢  用MPALL工具里的工具
例如这样的
Burner File=F:\Phison_2251-07_MPALL\MPALL_v5.03.0D\BN07V600T9.BIN
Firmware Name=F:\Phison_2251-07_MPALL\MPALL_v5.03.0D\FW07FF01V50353_20160720.bin

ctnet

eboy998 发表于 2021-10-7 18:54
为啥要用黑片固件呢  用MPALL工具里的工具
例如这样的
Burner File=F:\Phison_2251-07_MPALL\MPALL_v5.03.0 ...

用错了刷死该怎么办呢？

eboy998

压根儿就刷不死:titter:万一量产出错出现不认盘 短接数据角就可以了

ctnet

eboy998 发表于 2021-10-8 00:26
压根儿就刷不死万一量产出错出现不认盘 短接数据角就可以了

没有角蚜~~~~

eboy998

难道TSOP焊盘不算角 不能短接吗？:shocked:

ctnet

bbbaaa1 发表于 2021-10-6 20:02
看看前面发的贴子，东芝的颗粒好像可以量产，但海力士的不好量产

量产了个8G的


装个win10 光盘镜像

bbbaaa1

ctnet 发表于 2021-10-8 15:12
量产了个8G的

我也不知道了，量产的容量要大于ISO的文件大小，格式要是NTFS

damp

感谢，就是用这个工具搞成功的，不过默认的mp.ini不行，改了st.ini

su0056

damp 发表于 2021-10-15 14:55
感谢，就是用这个工具搞成功的，不过默认的mp.ini不行，改了st.ini

用的那个工具？